CM8R (H.A.S.L) Hot Air Solder Level Tape
Hot air leveling tape is specifically designed for use in the hot air leveling (HAL) process in the electronics and PCB (Printed Circuit Board) manufacturing industry. The HAL process is a surface finishing technique used to create a smooth, even solder coating on the exposed copper surfaces of a PCB.
The goal is to create a level and even solder surface on the exposed copper traces of the PCB, facilitating the soldering of electronic components. Using specialised tape helps in achieving precise and controlled soldering in specific areas, contributing to the overall quality of the PCB assembly.
usage
Masking Areas
The tape is applied to areas of the PCB where solder is not desired. This could include areas with surface mount components, gold-plated areas, or any other regions that should remain free of solder.
Resisting Solder Adhesion
The tape acts as a barrier, preventing molten solder from adhering to the masked areas during the hot air leveling process.
Precision Masking
Hot air leveling tape needs to provide precise masking to ensure accurate application and a clean finish. It should withstand the high temperatures involved in the HAL process without leaving residues.
Datasheet
Product Description
CM8R is a flatback paper/polyester composite laminate coated with an aggressive adhesive.
Applications
Designed for masking gold fingers during the hot air solder level process. Peels clean leaving no residue on removal.
Property Unit Value
Thickness of tape mm 0.3
Elongation % 5
Peel Adhesion (N/cm) 4.7
Tensile Strength (N/cm) 125
Operating Temperature C 250C 5 Sec
Colour Red
