DuPont™ Kapton® HN
DuPont™ Kapton® HN is commonly used in electronics and aerospace industries for its thermal and electrical insulation properties. It can withstand high temperatures making it suitable for applications like insulating wires, flexible printed circuits, and as a substrate for electronic components in environments with extreme conditions.
We manufacture a vast range of self-adhesive & non-adhesive die-cut shapes to customer’s drawings and exact specifications. We also convert our comprehensive range of tapes into standard discs/shape form from 3mm diameter upwards.
Product Description
A 1 Mil polyester film backing with a silicone pressure sensitive adhesive system engineered to leave no residue when removed.
Applications
Designed to perform in all phases of masking operations for printed circuit board production. Protects circuitry from splashes and chemical fumes.
Datasheet
Specification
Total Thickness Mils 4.0
Backing Thickness Mils 1.0
Elongation % 100
Adhesion to steel (oz/in) 25
Tensile Strength (N/25mm) 23
Adhesive System Silicone
Colour red
All values shown are approximate and are intended solely as a guide.
No responsibility is accepted for their accuracy. It is the users responsibility
to determine the suitability of the product for the intended application.